Publication:
Improving The Wafer Thinning Flow Robustness For 2.5D & 3D Applications
| dc.contributor.author | Jedidi, Nader | |
| dc.contributor.author | Kennes, Koen | |
| dc.contributor.author | Phommahaxay, Alain | |
| dc.contributor.author | Guerrero, Alice | |
| dc.contributor.author | Beyer, Gerald | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Jedidi, Nader | |
| dc.contributor.imecauthor | Kennes, Koen | |
| dc.contributor.imecauthor | Phommahaxay, Alain | |
| dc.contributor.imecauthor | Beyer, Gerald | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Kennes, Koen::0000-0002-5987-2167 | |
| dc.contributor.orcidimec | Phommahaxay, Alain::0000-0001-8672-2386 | |
| dc.contributor.orcidimec | Beyer, Gerald::0009-0001-0376-866X | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2025-04-16T08:31:16Z | |
| dc.date.available | 2025-02-15T21:14:41Z | |
| dc.date.available | 2025-04-16T08:31:16Z | |
| dc.date.issued | 2024 | |
| dc.identifier.doi | 10.1109/ESTC60143.2024.10712091 | |
| dc.identifier.eisbn | 979-8-3503-9036-0 | |
| dc.identifier.isbn | 979-8-3503-9037-7 | |
| dc.identifier.issn | 2687-9700 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/45219 | |
| dc.publisher | IEEE | |
| dc.source.conference | 10th IEEE Electronics System-Integration Technology Conference (ESTC) | |
| dc.source.conferencedate | SEP 11-13, 2024 | |
| dc.source.conferencelocation | Berlin | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 6 | |
| dc.title | Improving The Wafer Thinning Flow Robustness For 2.5D & 3D Applications | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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