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Conference contributions
Study of copper surface preparation by sequential atomic layer wet etching and laser annealing treatments
Publication:
Study of copper surface preparation by sequential atomic layer wet etching and laser annealing treatments
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Date
2017
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Iwasaki, Akihisa
;
Akanishi, Yuya
;
Mazzamuto, Fulvio
;
Kesters, Els
;
Le, Quoc Toan
;
Holsteyns, Frank
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1945
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Acq. date: 2025-12-13
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Views
1945
since deposited on 2021-10-24
1
last month
1
last week
Acq. date: 2025-12-13
Citations