Publication:

Study of copper surface preparation by sequential atomic layer wet etching and laser annealing treatments

Date

2017
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorIwasaki, Akihisa
dc.contributor.authorAkanishi, Yuya
dc.contributor.authorMazzamuto, Fulvio
dc.contributor.authorKesters, Els
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorHolsteyns, Frank
dc.contributor.imecauthorAkanishi, Yuya
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.date.accessioned2021-10-24T06:10:55Z
dc.date.available2021-10-24T06:10:55Z
dc.date.embargo9999-12-31
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28575
dc.identifier.urlhttp://ecst.ecsdl.org/content/80/2/233.abstract
dc.source.beginpage233
dc.source.conference232nd ECS Fall Meeting - 15th International Symposium on Semiconductor Cleaning Science and Technology - SCST15
dc.source.conferencedate1/10/2017
dc.source.conferencelocationNational Harbor, MD USA
dc.source.endpage241
dc.title

Study of copper surface preparation by sequential atomic layer wet etching and laser annealing treatments

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
37027.pdf
Size:
5 MB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions