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Thickness scaling of NiAl thin films for alternative interconnect metallization
Publication:
Thickness scaling of NiAl thin films for alternative interconnect metallization
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Date
2020
Proceedings Paper
https://doi.org/10.1109/IITC47697.2020.9515638
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Soulie, Jean-Philippe
;
Tokei, Zsolt
;
Swerts, Johan
;
Adelmann, Christoph
Journal
2020 IEEE International Interconnect Technology Conference - IITC
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Views
1882
since deposited on 2021-10-29
6
last month
6
last week
Acq. date: 2025-12-16
Citations