Publication:

Thickness scaling of NiAl thin films for alternative interconnect metallization

Date

2020
Proceedings Paper
https://doi.org/10.1109/IITC47697.2020.9515638
Simple item page Full metadata Statistics
 
dc.contributor.authorSoulie, Jean-Philippe
dc.contributor.authorTokei, Zsolt
dc.contributor.authorSwerts, Johan
dc.contributor.authorAdelmann, Christoph
dc.contributor.imecauthorSoulie, Jean-Philippe
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorSwerts, Johan
dc.contributor.imecauthorAdelmann, Christoph
dc.contributor.orcidimecSoulie, Jean-Philippe::0000-0002-5956-6485
dc.contributor.orcidimecAdelmann, Christoph::0000-0002-4831-3159
dc.date.accessioned2021-10-29T04:37:14Z
dc.date.available2021-10-29T04:37:14Z
dc.date.embargo9999-12-31
dc.date.issued2020
dc.identifier.doi10.1109/IITC47697.2020.9515638
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35995
dc.source.beginpage151
dc.source.conference2020 IEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate2020-10-05
dc.source.conferencelocationSan Jose (virtual)
dc.source.endpage153
dc.source.journal2020 IEEE International Interconnect Technology Conference - IITC
dc.title

Thickness scaling of NiAl thin films for alternative interconnect metallization

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
45107.pdf
Size:
634.1 KB
Format:
Adobe Portable Document Format
Description:
Published
Download
Publication available in collections:
Conference contributions