Publication:
Thermo-mechanical characterization of copper through-silicon-via intercnnect for 3D chip stacking
Date
| dc.contributor.author | Okoro, Chukwudi | |
| dc.contributor.thesisadvisor | Vandepitte, D. | |
| dc.contributor.thesisadvisor | Van Hoof, Chris | |
| dc.date.accessioned | 2021-10-18T19:47:33Z | |
| dc.date.available | 2021-10-18T19:47:33Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2010-12 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/17727 | |
| dc.title | Thermo-mechanical characterization of copper through-silicon-via intercnnect for 3D chip stacking | |
| dc.type | PHD thesis | |
| dspace.entity.type | Publication | |
| Files | Original bundle
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| Publication available in collections: |