Publication:

Improved PBTI reliability in junction-less nFETs fabricated at low thermal budget for 3D sequential integration

Date

2018
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorWu, Zhicheng
dc.contributor.authorFranco, Jacopo
dc.contributor.authorVandooren, Anne
dc.contributor.authorKaczer, Ben
dc.contributor.authorRoussel, Philippe
dc.contributor.authorRzepa, Gerhard
dc.contributor.authorLinten, Dimitri
dc.contributor.authorGroeseneken, Guido
dc.contributor.imecauthorWu, Zhicheng
dc.contributor.imecauthorFranco, Jacopo
dc.contributor.imecauthorVandooren, Anne
dc.contributor.imecauthorKaczer, Ben
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorLinten, Dimitri
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.orcidimecFranco, Jacopo::0000-0002-7382-8605
dc.contributor.orcidimecVandooren, Anne::0000-0002-2412-0176
dc.contributor.orcidimecKaczer, Ben::0000-0002-1484-4007
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecLinten, Dimitri::0000-0001-8434-1838
dc.contributor.orcidimecGroeseneken, Guido::0000-0003-3763-2098
dc.date.accessioned2021-10-26T09:46:29Z
dc.date.available2021-10-26T09:46:29Z
dc.date.embargo9999-12-31
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32296
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8727075
dc.source.beginpage5.2
dc.source.conferenceInternational Integrated Reliability Workshop - IIRW 2018
dc.source.conferencedate7/10/2018
dc.source.conferencelocationFallen Leaf Lake USA
dc.title

Improved PBTI reliability in junction-less nFETs fabricated at low thermal budget for 3D sequential integration

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
39826.pdf
Size:
546.62 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions