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Diffusion and adhesion issues of low permittivity dielectrics with copper for high performance interconnects
Publication:
Diffusion and adhesion issues of low permittivity dielectrics with copper for high performance interconnects
Date
2002-03
Dissertation
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Lanckmans, Filip
Journal
Abstract
Description
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2035
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations
Metrics
Views
2035
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations