Publication:
Diffusion and adhesion issues of low permittivity dielectrics with copper for high performance interconnects
Date
| dc.contributor.author | Lanckmans, Filip | |
| dc.contributor.thesisadvisor | Maex, Karen | |
| dc.contributor.thesisadvisor | Celis, Jean-Pierre | |
| dc.date.accessioned | 2021-10-14T22:07:53Z | |
| dc.date.available | 2021-10-14T22:07:53Z | |
| dc.date.issued | 2002-03 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/6513 | |
| dc.title | Diffusion and adhesion issues of low permittivity dielectrics with copper for high performance interconnects | |
| dc.type | PHD thesis | |
| dspace.entity.type | Publication | |
| Files | ||
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