Publication:

Impact of the electrochemical properties of silicon wafer surfaces on copper outplating from HF solutions

Date

1996
Proceedings Paper
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dc.contributor.authorTeerlinck, Ivo
dc.contributor.authorSchmidt, Harald
dc.contributor.authorRotondaro, Antonio
dc.contributor.authorHurd, Trace
dc.contributor.authorMouche, Laurent
dc.contributor.authorMertens, Paul
dc.contributor.authorMeuris, Marc
dc.contributor.authorHeyns, Marc
dc.contributor.authorVanhaeren, Danielle
dc.contributor.authorVandervorst, Wilfried
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorMeuris, Marc
dc.contributor.imecauthorHeyns, Marc
dc.contributor.imecauthorVanhaeren, Danielle
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.contributor.orcidimecVanhaeren, Danielle::0000-0001-8624-9533
dc.date.accessioned2021-09-29T15:31:45Z
dc.date.available2021-09-29T15:31:45Z
dc.date.embargo9999-12-31
dc.date.issued1996
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1529
dc.source.beginpage284
dc.source.conferenceProceedings of the Fourth International Symposium on Cleaning technology in Semiconductor Device Manufacturing
dc.source.conferencedate9/10/1995
dc.source.conferencelocationChicago, IL USA
dc.source.endpage291
dc.title

Impact of the electrochemical properties of silicon wafer surfaces on copper outplating from HF solutions

dc.typeProceedings paper
dspace.entity.typePublication
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