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Evaluation of the degree of damage after different conditions of He/H2 dry strip plasma on silica-based porous low-k materials - compatiblity study with chemical solutions

Date

2005
Proceedings Paper
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dc.contributor.authorKesters, Els
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorBoullart, Werner
dc.contributor.authorHan, Q.
dc.contributor.authorBerry, I.
dc.contributor.authorWaldfried, C.
dc.contributor.authorMertens, Paul
dc.contributor.authorHeyns, Marc
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorBoullart, Werner
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.date.accessioned2021-10-16T02:29:44Z
dc.date.available2021-10-16T02:29:44Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10687
dc.source.beginpage319
dc.source.conferenceCleaning Technology in Semiconductor Devices Manufacturing IX
dc.source.conferencedate16/10/2005
dc.source.conferencelocationLos Angeles, CA USA
dc.source.endpage326
dc.title

Evaluation of the degree of damage after different conditions of He/H2 dry strip plasma on silica-based porous low-k materials - compatiblity study with chemical solutions

dc.typeProceedings paper
dspace.entity.typePublication
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