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Characterization of Siliconcarbonitride bonding layer for plasma activated direct fusion bonding

 
dc.contributor.authorDoppelbauer, David
dc.contributor.authorFloetgen, Christoph
dc.contributor.authorGabas, Ignacio Gabriel Vicente
dc.contributor.authorIacovo, Serena
dc.contributor.authorBrems, Steven
dc.contributor.authorBeyne, Eric
dc.contributor.authorDuchoslav, Jiri
dc.contributor.authorGroiss, Heiko
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorBrems, Steven
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecBrems, Steven::0000-0002-0282-8528
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2025-04-16T08:42:22Z
dc.date.available2025-03-06T20:45:28Z
dc.date.available2025-04-16T08:42:22Z
dc.date.issued2024
dc.description.wosFundingTextThe financial support by the Austrian Federal Ministry of Labour and Economy, the National Foundation for Research, Technology and Development and the Christian Doppler Research Association is gratefully acknowledged.
dc.identifier.doi10.1109/IITC61274.2024.10732483
dc.identifier.eisbn979-8-3503-8517-5
dc.identifier.isbn979-8-3503-8518-2
dc.identifier.issn2380-632X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45317
dc.publisherIEEE
dc.source.conference2024 International Interconnect Technology Conference
dc.source.conferencedateJUN 03-06, 2024
dc.source.conferencelocationSan Jose
dc.source.journalN/A
dc.source.numberofpages3
dc.title

Characterization of Siliconcarbonitride bonding layer for plasma activated direct fusion bonding

dc.typeProceedings paper
dspace.entity.typePublication
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