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B-spline X-ray diffraction imaging – rapid non-destructive measurement of die warpage in ball grid array packages

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dc.contributor.authorCowley, A.
dc.contributor.authorIvankovic, A.
dc.contributor.authorWong, C.S
dc.contributor.authorBennett, N.S.
dc.contributor.authorDanilewsky, A.N.
dc.contributor.authorGonzalez, Mario
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVandevelde, Bart
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorMcNally, P.J.
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecGonzalez, Mario::0000-0003-4374-4854
dc.contributor.orcidimecCherman, Vladimir::0000-0002-8068-9236
dc.date.accessioned2021-10-23T10:23:24Z
dc.date.available2021-10-23T10:23:24Z
dc.date.issued2016
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26482
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0026271415302778
dc.source.beginpage108
dc.source.endpage116
dc.source.journalMicroelectronics Reliability
dc.source.volume59
dc.title

B-spline X-ray diffraction imaging – rapid non-destructive measurement of die warpage in ball grid array packages

dc.typeJournal article
dspace.entity.typePublication
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