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Enhanced growth and Cu diffusion barrier properties of thermal ALD TaNC films
Publication:
Enhanced growth and Cu diffusion barrier properties of thermal ALD TaNC films
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Date
2013
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Wojcik, Henry
;
Hossbach, Christoph
;
Kubasch, Christoph
;
Verdonck, Patrick
;
Barbarin, Yohan
;
Merkel, Ulrich
;
Bartha, Johann
;
Hubner, Rene
;
Engelmann, Hans-Jurgen
;
Friedemann, Michael
Journal
Microelectronic Engineering
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Acq. date: 2026-02-26
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Statistics
Views
1856
since deposited on 2021-10-21
1
last week
Acq. date: 2026-02-26
Citations