Publication:

Enhanced growth and Cu diffusion barrier properties of thermal ALD TaNC films

Date

2013
Journal article
Simple item page Full metadata Statistics
 
dc.contributor.authorWojcik, Henry
dc.contributor.authorHossbach, Christoph
dc.contributor.authorKubasch, Christoph
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorBarbarin, Yohan
dc.contributor.authorMerkel, Ulrich
dc.contributor.authorBartha, Johann
dc.contributor.authorHubner, Rene
dc.contributor.authorEngelmann, Hans-Jurgen
dc.contributor.authorFriedemann, Michael
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.date.accessioned2021-10-21T14:40:20Z
dc.date.available2021-10-21T14:40:20Z
dc.date.issued2013
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23400
dc.identifier.urlwww.elsevier.com/locate/mee
dc.source.beginpage29
dc.source.endpage34
dc.source.journalMicroelectronic Engineering
dc.source.volume110
dc.title

Enhanced growth and Cu diffusion barrier properties of thermal ALD TaNC films

dc.typeJournal article
dspace.entity.typePublication
Files
Publication available in collections:
Articles