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Tackling CMP challenges related to the integration of III-V materials for <10nm node applications
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Tackling CMP challenges related to the integration of III-V materials for <10nm node applications
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Date
2015
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Teugels, Lieve
;
Ong, Patrick
;
Waldron, Niamh
;
Boccardi, Guillaume
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1968
since deposited on 2021-10-22
Acq. date: 2025-12-17
Citations
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Views
1968
since deposited on 2021-10-22
Acq. date: 2025-12-17
Citations