Publication:
Tackling CMP challenges related to the integration of III-V materials for <10nm node applications
Date
| dc.contributor.author | Teugels, Lieve | |
| dc.contributor.author | Ong, Patrick | |
| dc.contributor.author | Waldron, Niamh | |
| dc.contributor.author | Boccardi, Guillaume | |
| dc.contributor.imecauthor | Teugels, Lieve | |
| dc.contributor.imecauthor | Ong, Patrick | |
| dc.contributor.imecauthor | Waldron, Niamh | |
| dc.contributor.imecauthor | Boccardi, Guillaume | |
| dc.contributor.orcidimec | Teugels, Lieve::0000-0002-6613-9414 | |
| dc.contributor.orcidimec | Ong, Patrick::0000-0002-2072-292X | |
| dc.contributor.orcidimec | Boccardi, Guillaume::0000-0003-3226-4572 | |
| dc.date.accessioned | 2021-10-22T23:30:13Z | |
| dc.date.available | 2021-10-22T23:30:13Z | |
| dc.date.issued | 2015 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/25988 | |
| dc.source.conference | Semicon Korea | |
| dc.source.conferencedate | 4/02/2015 | |
| dc.source.conferencelocation | Seoul Korea | |
| dc.title | Tackling CMP challenges related to the integration of III-V materials for <10nm node applications | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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