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Approaches to Enable Patterning of Tight Pitches towards High NA EUV

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dc.contributor.authorTadatomo, Hiroki
dc.contributor.authorDauendorffer, Arnaud
dc.contributor.authorOnitsuka, Tomoya
dc.contributor.authorGenjima, Hisashi
dc.contributor.authorIdo, Yasuyuki
dc.contributor.authorOkada, Soichiro
dc.contributor.authorKuwahara, Yuhei
dc.contributor.authorHara, Arisa
dc.contributor.authorDinh, Congque
dc.contributor.authorFujimoto, Seiji
dc.contributor.authorKawakami, Shinichiro
dc.contributor.authorMuramatsu, Makoto
dc.contributor.authorShimura, Satoru
dc.contributor.authorNafus, Kathleen
dc.contributor.authorOikawa, Noriaki
dc.contributor.authorOno, Kenta
dc.contributor.authorFeurprier, Yannick
dc.contributor.authorDemand, Marc
dc.contributor.authorNegreira, Ainhoa Romo
dc.contributor.authorNagahara, Seiji
dc.contributor.imecauthorBlanco, Victor
dc.contributor.imecauthorFoubert, Philippe
dc.contributor.imecauthorDe Simone, Danilo
dc.contributor.orcidimecDe Simone, Danilo::0000-0003-3927-5207
dc.contributor.orcidimecBlanco, Victor::0000-0003-4308-0381
dc.date.accessioned2023-01-04T10:50:41Z
dc.date.available2022-09-08T02:39:18Z
dc.date.available2023-01-04T10:50:41Z
dc.date.issued2022
dc.identifier.doi10.1117/12.2614012
dc.identifier.eisbn978-1-5106-4988-0
dc.identifier.isbn978-1-5106-4987-3
dc.identifier.issn0277-786X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40392
dc.publisherSPIE-INT SOC OPTICAL ENGINEERING
dc.source.beginpage120560F
dc.source.conferenceConference on Advanced Etch Technology and Process Integration for Nanopatterning XI Part of SPIE Advanced Lithography and Patterning Conference
dc.source.conferencedateAPR 24-MAY 27, 2020-2022
dc.source.conferencelocationSan Jose
dc.source.journalProceedings of SPIE
dc.source.numberofpages7
dc.source.volume12056
dc.title

Approaches to Enable Patterning of Tight Pitches towards High NA EUV

dc.typeProceedings paper
dspace.entity.typePublication
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