Publication:

Challenges of clean/strip processing for Cu/LowK technology

Date

2004
Proceedings Paper
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dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorKesters, Els
dc.contributor.authorIacopi, Francesca
dc.contributor.authorVan Aelst, Joke
dc.contributor.authorStruyf, Herbert
dc.contributor.authorBoullart, Werner
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorVan Aelst, Joke
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorBoullart, Werner
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.date.accessioned2021-10-15T12:40:30Z
dc.date.available2021-10-15T12:40:30Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8526
dc.source.beginpage187
dc.source.conferenceProceedings of the IEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate7/06/2004
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage189
dc.title

Challenges of clean/strip processing for Cu/LowK technology

dc.typeProceedings paper
dspace.entity.typePublication
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