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Acoustic modulation during laser debonding of collective hybrid bonded dies

 
dc.contributor.authorKennes, Koen
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorGuerrero, Alice
dc.contributor.authorBumueller, Dennis
dc.contributor.authorSuhard, Samuel
dc.contributor.authorBex, Pieter
dc.contributor.authorTussing, Sebastian
dc.contributor.authorLiu, Xiao
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorKennes, Koen
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecKennes, Koen::0000-0002-5987-2167
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.date.accessioned2023-08-10T11:45:48Z
dc.date.available2023-06-20T10:37:03Z
dc.date.available2023-08-10T11:45:48Z
dc.date.issued2021
dc.identifier.doi10.1109/ECTC32696.2021.00334
dc.identifier.eisbn978-0-7381-4523-5
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/41968
dc.publisherIEEE COMPUTER SOC
dc.source.beginpage2126
dc.source.conferenceIEEE 71st Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateJUN 01-JUL 04, 2021
dc.source.conferencelocationSan Diego
dc.source.endpage2133
dc.source.journalna
dc.source.numberofpages8
dc.title

Acoustic modulation during laser debonding of collective hybrid bonded dies

dc.typeProceedings paper
dspace.entity.typePublication
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