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Electromigration behaviour of 0.3 μm damascene vs. plasma-etched interconnects: a lifetime and drift analysis
Publication:
Electromigration behaviour of 0.3 μm damascene vs. plasma-etched interconnects: a lifetime and drift analysis
Date
1998
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Proost, Joris
;
Li, Hua
;
Brijs, Bert
;
Witvrouw, Ann
;
Maex, Karen
Journal
Abstract
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9
since deposited on 2021-10-01
Acq. date: 2025-10-23
Views
1986
since deposited on 2021-10-01
Acq. date: 2025-10-23
Citations
Metrics
Downloads
9
since deposited on 2021-10-01
Acq. date: 2025-10-23
Views
1986
since deposited on 2021-10-01
Acq. date: 2025-10-23
Citations