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Conference contributions
Electromigration behaviour of 0.3 μm damascene vs. plasma-etched interconnects: a lifetime and drift analysis
Publication:
Electromigration behaviour of 0.3 μm damascene vs. plasma-etched interconnects: a lifetime and drift analysis
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Date
1998
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Proost, Joris
;
Li, Hua
;
Brijs, Bert
;
Witvrouw, Ann
;
Maex, Karen
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9
since deposited on 2021-10-01
Acq. date: 2025-12-10
Views
1990
since deposited on 2021-10-01
1
last month
Acq. date: 2025-12-10
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Metrics
Downloads
9
since deposited on 2021-10-01
Acq. date: 2025-12-10
Views
1990
since deposited on 2021-10-01
1
last month
Acq. date: 2025-12-10
Citations