Electromigration behaviour of 0.3 μm damascene vs. plasma-etched interconnects: a lifetime and drift analysis

dc.contributor.author	Proost, Joris
dc.contributor.author	Li, Hua
dc.contributor.author	Brijs, Bert
dc.contributor.author	Witvrouw, Ann
dc.contributor.author	Maex, Karen
dc.contributor.imecauthor	Maex, Karen
dc.date.accessioned	2021-10-01T08:44:08Z
dc.date.available	2021-10-01T08:44:08Z
dc.date.embargo	9999-12-31
dc.date.issued	1998
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/2884
dc.source.beginpage	110
dc.source.conference	Proceedings of the IEEE 1998 International Interconnect Technology Conference
dc.source.conferencedate	1/06/1998
dc.source.conferencelocation	San Francisco, CA USA
dc.source.endpage	112
dc.title	Electromigration behaviour of 0.3 μm damascene vs. plasma-etched interconnects: a lifetime and drift analysis
dc.type	Proceedings paper
dspace.entity.type	Publication
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