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Analysis, modelling and design of chip scale packages (CSPs) for RF and high-speed digital interconnections
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Analysis, modelling and design of chip scale packages (CSPs) for RF and high-speed digital interconnections
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Date
2004-10
Dissertation
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Chandrasekhar, Arun
Journal
Abstract
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1900
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Acq. date: 2025-12-10
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Views
1900
since deposited on 2021-10-15
3
last month
3
last week
Acq. date: 2025-12-10
Citations