Publication:

Analysis, modelling and design of chip scale packages (CSPs) for RF and high-speed digital interconnections

Date

 
dc.contributor.authorChandrasekhar, Arun
dc.contributor.thesisadvisorNauwelaers, Bart
dc.contributor.thesisadvisorMertens, Robert
dc.date.accessioned2021-10-15T12:50:41Z
dc.date.available2021-10-15T12:50:41Z
dc.date.issued2004-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8668
dc.title

Analysis, modelling and design of chip scale packages (CSPs) for RF and high-speed digital interconnections

dc.typePHD thesis
dspace.entity.typePublication
Files
Publication available in collections: