Publication:
Analysis, modelling and design of chip scale packages (CSPs) for RF and high-speed digital interconnections
Date
| dc.contributor.author | Chandrasekhar, Arun | |
| dc.contributor.thesisadvisor | Nauwelaers, Bart | |
| dc.contributor.thesisadvisor | Mertens, Robert | |
| dc.date.accessioned | 2021-10-15T12:50:41Z | |
| dc.date.available | 2021-10-15T12:50:41Z | |
| dc.date.issued | 2004-10 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/8668 | |
| dc.title | Analysis, modelling and design of chip scale packages (CSPs) for RF and high-speed digital interconnections | |
| dc.type | PHD thesis | |
| dspace.entity.type | Publication | |
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