Publication:

Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications

Date

2020
Journal article
https://doi.org/10.1149/2162-8777/abd260
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dc.contributor.authorNagano, Fuya
dc.contributor.authorIacovo, Serena
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorSleeckx, Erik
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Gendt, Stefan
dc.contributor.imecauthorNagano, F.
dc.contributor.imecauthorIacovo, S.
dc.contributor.imecauthorPhommahaxay, A.
dc.contributor.imecauthorInoue, F.
dc.contributor.imecauthorSleeckx, E.
dc.contributor.imecauthorBeyer, G.
dc.contributor.imecauthorBeyne, E.
dc.contributor.imecauthorDe. Gendt, S.
dc.contributor.imecauthorNagano, Fuya
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecNagano, F.::0000-0001-5315-8694
dc.contributor.orcidimecInoue, F.::0000-0003-2292-846X
dc.contributor.orcidimecBeyne, E.::0000-0002-3096-050X
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.accessioned2022-01-10T12:20:16Z
dc.date.available2021-11-02T16:06:48Z
dc.date.available2022-01-10T12:20:16Z
dc.date.issued2020
dc.identifier.doi10.1149/2162-8777/abd260
dc.identifier.issn2162-8769
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/38304
dc.publisherELECTROCHEMICAL SOC INC
dc.source.beginpage123011
dc.source.issue12
dc.source.journalECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
dc.source.numberofpages7
dc.source.volume9
dc.subject.keywordsSOLDER JOINTS
dc.subject.keywordsSURFACE
dc.subject.keywordsTECHNOLOGY
dc.subject.keywordsSICN
dc.title

Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications

dc.typeJournal article
dspace.entity.typePublication
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