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Dummy design characterization for STI CMP with fixed abrasive

Date

2014-11
Proceedings Paper
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dc.contributor.authorTsvetanova, Diana
dc.contributor.authorDevriendt, Katia
dc.contributor.authorOng, Patrick
dc.contributor.authorVandeweyer, Tom
dc.contributor.authorDelande, Tinne
dc.contributor.authorChew, Soon Aik
dc.contributor.authorHoriguchi, Naoto
dc.contributor.authorStruyf, Herbert
dc.contributor.imecauthorTsvetanova, Diana
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorOng, Patrick
dc.contributor.imecauthorVandeweyer, Tom
dc.contributor.imecauthorDelande, Tinne
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.contributor.orcidimecOng, Patrick::0000-0002-2072-292X
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.date.accessioned2021-10-22T06:45:21Z
dc.date.available2021-10-22T06:45:21Z
dc.date.issued2014-11
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24638
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=7017279
dc.source.beginpage199
dc.source.conferenceInternational Conference on Planarization Technology - ICPT
dc.source.conferencedate19/11/2014
dc.source.conferencelocationKobe Japan
dc.source.endpage202
dc.title

Dummy design characterization for STI CMP with fixed abrasive

dc.typeProceedings paper
dspace.entity.typePublication
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