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Influence of intermetallic properties of lead-free flip chip solder joints
Publication:
Influence of intermetallic properties of lead-free flip chip solder joints
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Date
2008
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Limaye, Paresh
;
Vandevelde, Bart
;
Labie, Riet
;
Vandepitte, Dirk
;
Verlinden, Bert
Journal
IEEE Transactions on Advanced Packaging
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1888
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Acq. date: 2025-12-10
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Views
1888
since deposited on 2021-10-17
1
last month
Acq. date: 2025-12-10
Citations