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Influence of intermetallic properties of lead-free flip chip solder joints
Publication:
Influence of intermetallic properties of lead-free flip chip solder joints
Date
2008
Journal article
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20270.pdf
4.49 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Limaye, Paresh
;
Vandevelde, Bart
;
Labie, Riet
;
Vandepitte, Dirk
;
Verlinden, Bert
Journal
IEEE Transactions on Advanced Packaging
Abstract
Description
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1882
since deposited on 2021-10-17
411
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Acq. date: 2025-10-24
Citations
Metrics
Views
1882
since deposited on 2021-10-17
411
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations