Publication:

Influence of intermetallic properties of lead-free flip chip solder joints

Date

2008
Journal article
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dc.contributor.authorLimaye, Paresh
dc.contributor.authorVandevelde, Bart
dc.contributor.authorLabie, Riet
dc.contributor.authorVandepitte, Dirk
dc.contributor.authorVerlinden, Bert
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorLabie, Riet
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.date.accessioned2021-10-17T08:24:53Z
dc.date.available2021-10-17T08:24:53Z
dc.date.embargo9999-12-31
dc.date.issued2008
dc.identifier.issn1521-3323
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14041
dc.source.beginpage51
dc.source.endpage57
dc.source.issue1
dc.source.journalIEEE Transactions on Advanced Packaging
dc.source.volume31
dc.title

Influence of intermetallic properties of lead-free flip chip solder joints

dc.typeJournal article
dspace.entity.typePublication
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