Publication:

Evaluation of metallization options for advanced Cu interconnects application

Date

2011
Proceedings Paper
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dc.contributor.authorJourdan, Nicolas
dc.contributor.authorCarbonell, Laure
dc.contributor.authorHeylen, Nancy
dc.contributor.authorSwerts, Johan
dc.contributor.authorArmini, Silvia
dc.contributor.authorMaestre Caro, Arantxa
dc.contributor.authorDemuynck, Steven
dc.contributor.authorCroes, Kristof
dc.contributor.authorBeyer, Gerald
dc.contributor.authorTokei, Zsolt
dc.contributor.authorVan Elshocht, Sven
dc.contributor.authorVancoille, Eric
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorSwerts, Johan
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorVan Elshocht, Sven
dc.contributor.imecauthorVancoille, Eric
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecVan Elshocht, Sven::0000-0002-6512-1909
dc.date.accessioned2021-10-19T14:39:19Z
dc.date.available2021-10-19T14:39:19Z
dc.date.embargo9999-12-31
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19142
dc.source.beginpage515
dc.source.conferenceChina Semiconductor Technology International Conference - CSTIC
dc.source.conferencedate13/03/2011
dc.source.conferencelocationShanghai china
dc.source.endpage521
dc.title

Evaluation of metallization options for advanced Cu interconnects application

dc.typeProceedings paper
dspace.entity.typePublication
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