Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Conference contributions
Multi-visit TAMs to reduce the post-bond test length of 2.5D-SICs with a passive silicon interposer base
Publication:
Multi-visit TAMs to reduce the post-bond test length of 2.5D-SICs with a passive silicon interposer base
Copy permalink
Date
2011
Proceedings Paper
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Chi, Chun-Chuan
;
Marinissen, Erik Jan
;
Goel, Sandeep K.
;
Wu, Cheng-Wen
Journal
Abstract
Description
Statistics
Views
1917
since deposited on 2021-10-19
Acq. date: 2026-08-05
Citations
Statistics
Views
1917
since deposited on 2021-10-19
Acq. date: 2026-08-05
Citations