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Effective and Efficient Test and Diagnosis Pattern Generation for Many Inter-Die Interconnects in Chiplet-Based Packages
Publication:
Effective and Efficient Test and Diagnosis Pattern Generation for Many Inter-Die Interconnects in Chiplet-Based Packages
Date
2023
Proceedings Paper
https://doi.org/10.1109/3DIC57175.2023.10154900
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2.44 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Chuang, Po-Yao
;
Lorenzelli, Francesco
;
Chakravarty, Sreejit
;
Boutobza, Slimane
;
Wu, Cheng-Wen
;
Gielen, Georges
;
Marinissen, Erik Jan
Journal
2023 IEEE International 3D Systems Integration Conference (3DIC)
Abstract
Description
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Views
874
since deposited on 2023-08-10
Acq. date: 2025-10-25
Citations
Metrics
Views
874
since deposited on 2023-08-10
Acq. date: 2025-10-25
Citations