Publication:

Effective and Efficient Test and Diagnosis Pattern Generation for Many Inter-Die Interconnects in Chiplet-Based Packages

Date

2023
Proceedings Paper
https://doi.org/10.1109/3DIC57175.2023.10154900
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dc.contributor.authorChuang, Po-Yao
dc.contributor.authorLorenzelli, Francesco
dc.contributor.authorChakravarty, Sreejit
dc.contributor.authorBoutobza, Slimane
dc.contributor.authorWu, Cheng-Wen
dc.contributor.authorGielen, Georges
dc.contributor.authorMarinissen, Erik Jan
dc.contributor.imecauthorChuang, Po-Yao
dc.contributor.imecauthorLorenzelli, Francesco
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecChuang, Po-Yao::0000-0001-7325-8836
dc.contributor.orcidimecLorenzelli, Francesco::0000-0001-6465-7157
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.date.accessioned2024-04-04T13:41:28Z
dc.date.available2023-08-10T17:37:01Z
dc.date.available2023-08-16T07:59:11Z
dc.date.available2024-04-04T13:41:28Z
dc.date.embargo9999-12-31
dc.date.issued2023
dc.identifier.doi10.1109/3DIC57175.2023.10154900
dc.identifier.eisbn979-8-3503-1137-2
dc.identifier.issn2164-0157
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42313
dc.publisherIEEE
dc.source.conferenceIEEE International 3D Systems Integration Conference (3DIC)
dc.source.conferencedateMAY 10-12, 2023
dc.source.conferencelocationCork
dc.source.journal2023 IEEE International 3D Systems Integration Conference (3DIC)
dc.source.numberofpages6
dc.title

Effective and Efficient Test and Diagnosis Pattern Generation for Many Inter-Die Interconnects in Chiplet-Based Packages

dc.typeProceedings paper
dspace.entity.typePublication
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