Publication:

Direct etched Cu characterization for advanced interconnects

Date

2015
Proceedings Paper
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dc.contributor.authorWen, Liang Gong
dc.contributor.authorYamashita, Fumiko
dc.contributor.authorTang, Baojun
dc.contributor.authorCroes, Kristof
dc.contributor.authorTahara, Shigeru
dc.contributor.authorShimoda, Keiichi
dc.contributor.authorMaeshiro, Takeru
dc.contributor.authorNishimura, Eiichi
dc.contributor.authorLazzarino, Frederic
dc.contributor.authorCiofi, Ivan
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorLazzarino, Frederic
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.date.accessioned2021-10-23T00:59:34Z
dc.date.available2021-10-23T00:59:34Z
dc.date.embargo9999-12-31
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26174
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7325613
dc.source.beginpage173
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM
dc.source.conferencedate18/05/2015
dc.source.conferencelocationGrenoble France
dc.source.endpage176
dc.title

Direct etched Cu characterization for advanced interconnects

dc.typeProceedings paper
dspace.entity.typePublication
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