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Chemical and structural modifications in a 193-nm photoresist after low-k dry etch
Publication:
Chemical and structural modifications in a 193-nm photoresist after low-k dry etch
Date
2008
Journal article
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Kesters, Els
;
Claes, Martine
;
Le, Quoc Toan
;
Lux, Marcel
;
Franquet, Alexis
;
Vereecke, Guy
;
Mertens, Paul
;
Frank, Martin M.
;
Carleer, Robert
;
Adriaensens, Peter
;
Biebuyck, J.J.
;
Bebelman, Sabine
Journal
Thin Solid Films
Abstract
Description
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Views
1939
since deposited on 2021-10-17
412
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations
Metrics
Views
1939
since deposited on 2021-10-17
412
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations