Publication:

Chemical and structural modifications in a 193-nm photoresist after low-k dry etch

Date

2008
Journal article
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dc.contributor.authorKesters, Els
dc.contributor.authorClaes, Martine
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorLux, Marcel
dc.contributor.authorFranquet, Alexis
dc.contributor.authorVereecke, Guy
dc.contributor.authorMertens, Paul
dc.contributor.authorFrank, Martin M.
dc.contributor.authorCarleer, Robert
dc.contributor.authorAdriaensens, Peter
dc.contributor.authorBiebuyck, J.J.
dc.contributor.authorBebelman, Sabine
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorFranquet, Alexis
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorAdriaensens, Peter
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecFranquet, Alexis::0000-0002-7371-8852
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.date.accessioned2021-10-17T07:58:53Z
dc.date.available2021-10-17T07:58:53Z
dc.date.issued2008
dc.identifier.issn0040-6090
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13947
dc.source.beginpage3454
dc.source.endpage3459
dc.source.issue11
dc.source.journalThin Solid Films
dc.source.volume516
dc.title

Chemical and structural modifications in a 193-nm photoresist after low-k dry etch

dc.typeJournal article
dspace.entity.typePublication
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