Skip to content
Institutional repository
Communities & Collections
Browse
Site
Log In
imec Publications
Conference contributions
Temporary 0-level MEMS packaging using a heat decomposable sealing ring
Publication:
Temporary 0-level MEMS packaging using a heat decomposable sealing ring
Date
2011
Proceedings Paper
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Bogaerts, Lieve
;
Phommahaxay, Alain
;
Gerets, Carine
;
Jaenen, Patrick
;
Van Hoof, Rita
;
Severi, Simone
;
De Coster, Jeroen
;
Soussan, Philippe
;
Witvrouw, Ann
;
Beernaert, Roel
;
Rudra, Sukumar
Journal
Abstract
Description
Metrics
Views
1890
since deposited on 2021-10-19
402
item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations
Metrics
Views
1890
since deposited on 2021-10-19
402
item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations