Publication:
Temporary 0-level MEMS packaging using a heat decomposable sealing ring
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1894 since deposited on 2021-10-19
3last month
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Acq. date: 2026-03-16
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Statistics
Views
1894 since deposited on 2021-10-19
3last month
1last week
Acq. date: 2026-03-16
Citations