Publication:

Temporary 0-level MEMS packaging using a heat decomposable sealing ring

Date

2011
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorBogaerts, Lieve
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorGerets, Carine
dc.contributor.authorJaenen, Patrick
dc.contributor.authorVan Hoof, Rita
dc.contributor.authorSeveri, Simone
dc.contributor.authorDe Coster, Jeroen
dc.contributor.authorSoussan, Philippe
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorBeernaert, Roel
dc.contributor.authorRudra, Sukumar
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorJaenen, Patrick
dc.contributor.imecauthorVan Hoof, Rita
dc.contributor.imecauthorSeveri, Simone
dc.contributor.imecauthorDe Coster, Jeroen
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.date.accessioned2021-10-19T12:36:25Z
dc.date.available2021-10-19T12:36:25Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18588
dc.source.beginpage1497
dc.source.conferenceEurosensors XXV
dc.source.conferencedate4/09/2011
dc.source.conferencelocationAthens Greece
dc.source.endpage1500
dc.title

Temporary 0-level MEMS packaging using a heat decomposable sealing ring

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions