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Integration of a composite SiO2HfO2 interpoly dielectric layer for low voltage polypoly erase in a 0.18μm HIMOSTM memory cell.
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1950 since deposited on 2021-10-15
Acq. date: 2025-10-23
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1950 since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations