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Design of test structures for the characterization of thermal-mechanical stress in 3D stacked IC
Publication:
Design of test structures for the characterization of thermal-mechanical stress in 3D stacked IC
Date
2012
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Minas, Nikolaos
;
Van der Plas, Geert
;
Oprins, Herman
;
Mercha, Abdelkarim
;
Cherman, Vladimir
;
Torregiani, Cristina
;
Rakowski, Michal
;
Marchal, Pol
Journal
IEEE Transactions on Semiconductor Manufacturing
Abstract
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1931
since deposited on 2021-10-20
Acq. date: 2025-10-23
Citations
Metrics
Views
1931
since deposited on 2021-10-20
Acq. date: 2025-10-23
Citations