Publication:

Design of test structures for the characterization of thermal-mechanical stress in 3D stacked IC

Date

2012
Journal article
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dc.contributor.authorMinas, Nikolaos
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorOprins, Herman
dc.contributor.authorMercha, Abdelkarim
dc.contributor.authorCherman, Vladimir
dc.contributor.authorTorregiani, Cristina
dc.contributor.authorRakowski, Michal
dc.contributor.authorMarchal, Pol
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorRakowski, Michal
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.date.accessioned2021-10-20T13:31:49Z
dc.date.available2021-10-20T13:31:49Z
dc.date.embargo9999-12-31
dc.date.issued2012
dc.identifier.issn0894-6507
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21147
dc.source.beginpage365
dc.source.endpage371
dc.source.issue3
dc.source.journalIEEE Transactions on Semiconductor Manufacturing
dc.source.volume25
dc.title

Design of test structures for the characterization of thermal-mechanical stress in 3D stacked IC

dc.typeJournal article
dspace.entity.typePublication
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