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Conference contributions
A grain size limitation inherent to electroplated copper films
Publication:
A grain size limitation inherent to electroplated copper films
Date
2000
Proceedings Paper
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4132.pdf
270.78 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Brongersma, Sywert
;
Richard, Emmanuel
;
Vervoort, Iwan
;
Maex, Karen
Journal
Abstract
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1953
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations
Metrics
Views
1953
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations