Publication:

A grain size limitation inherent to electroplated copper films

Date

2000
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorRichard, Emmanuel
dc.contributor.authorVervoort, Iwan
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.date.accessioned2021-10-14T12:42:24Z
dc.date.available2021-10-14T12:42:24Z
dc.date.embargo9999-12-31
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4157
dc.source.beginpage31
dc.source.conferenceProceedings of the IEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate5/06/2000
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage33
dc.title

A grain size limitation inherent to electroplated copper films

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
4132.pdf
Size:
270.78 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions