Publication:

Relationships between deposition parameters, step coverage, throughput, and electrical properties of PEALD SiO2 insulation liners for HVM TSV application

Date

2011
Meeting abstract
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dc.contributor.authorJung, In Soo
dc.contributor.authorWoo, Jeong-Jun
dc.contributor.authorKwon, Hak Yong
dc.contributor.authorKim, Young-Jae
dc.contributor.authorKang, Dong-Suk
dc.contributor.authorPark, Ju-Hyuk
dc.contributor.authorAhn, Dae-Young
dc.contributor.authorChoi, Seung-Woo
dc.contributor.authorPark, Hyung-Sang
dc.contributor.authorYoo, Yong Min
dc.contributor.authorCivale, Yann
dc.contributor.authorRedolfi, Augusto
dc.contributor.authorThangaraju, Sarasvathi
dc.contributor.authorTravaly, Youssef
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Roest, David
dc.contributor.authorBeynet, Julien
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Roest, David
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecSwinnen, Bart::0000-0002-6878-7124
dc.date.accessioned2021-10-19T14:40:01Z
dc.date.available2021-10-19T14:40:01Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19144
dc.source.conference11th International Conference on Atomic Layer Deposition - ALD
dc.source.conferencedate26/06/2011
dc.source.conferencelocationCambridge, MA USA
dc.title

Relationships between deposition parameters, step coverage, throughput, and electrical properties of PEALD SiO2 insulation liners for HVM TSV application

dc.typeMeeting abstract
dspace.entity.typePublication
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