Publication:
A novel iso-thermal intermetallic compound insertion bonding approach to improve throughput for 3D die to wafer stacking
| dc.contributor.author | Hou, Lin | |
| dc.contributor.author | Derakhshandeh, Jaber | |
| dc.contributor.author | Capuz, Giovanni | |
| dc.contributor.author | Lofrano, Melina | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Miller, Andy | |
| dc.contributor.author | Beyer, Gerald | |
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.imecauthor | Hou, Lin | |
| dc.contributor.imecauthor | De Wolf, Ingrid | |
| dc.contributor.orcidext | Capuz, Giovanni::0000-0002-5263-4836 | |
| dc.contributor.orcidext | Beyne, Eric::0000-0002-3096-050X | |
| dc.contributor.orcidimec | Hou, Lin::0000-0002-9061-9792 | |
| dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
| dc.date.accessioned | 2023-06-20T10:39:04Z | |
| dc.date.available | 2023-06-20T10:39:04Z | |
| dc.date.issued | 2020 | |
| dc.identifier.doi | 10.1109/ECTC32862.2020.00228 | |
| dc.identifier.eisbn | 978-1-7281-6180-8 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42028 | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 1442 | |
| dc.source.conference | 70th IEEE Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | JUN 03-30, 2020 | |
| dc.source.endpage | 1447 | |
| dc.source.numberofpages | 6 | |
| dc.title | A novel iso-thermal intermetallic compound insertion bonding approach to improve throughput for 3D die to wafer stacking | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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