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Non-destructive in-line IMC thickness measurement using acoustic metrology

Date

2019
Proceedings Paper
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dc.contributor.authorMukundhan, Priya
dc.contributor.authorHou, Lin
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorLiebens, Maarten
dc.contributor.imecauthorHou, Lin
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorLiebens, Maarten
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.date.accessioned2021-10-27T14:25:28Z
dc.date.available2021-10-27T14:25:28Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33632
dc.identifier.urlhttps://doi.org/10.4071/2380-4505-2019.1.000274
dc.source.beginpage274
dc.source.conferenceInternational Symposium on Microelectronics: Fall 2019
dc.source.conferencedate1/10/2019
dc.source.conferencelocationBoston, MA USA
dc.source.endpage279
dc.title

Non-destructive in-line IMC thickness measurement using acoustic metrology

dc.typeProceedings paper
dspace.entity.typePublication
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