Browsing imec Publications by imec author "31bc2924ec63747723dfcf06d7b182d39bc7949e"

18% efficiency IBC cell with rear-surface processed on quartz

Dross, Frederic; O'Sullivan, Barry; Debucquoy, Maarten; Bearda, Twan; Govaerts, Jonathan; Labie, Riet; Loozen, Xavier; Granata, Stefano; El Daif, Ounsi; Trompoukis, Christos; Van Nieuwenhuysen, Kris; Meuris, Marc; Gordon, Ivan; Posthuma, Niels; Baert, Kris; Poortmans, Jef; Boulord, Caroline; Beaucarne, Guy (2013)

A PoF based methodology to assess the reliability of a sensor module operating in harsh industrial environments

Nawghane, Chinmay; Vandevelde, Bart; Labie, Riet; Michiels, Sam; Hughes, Danny; Liu, Mengyao (2022-04-20)

A simple copper metallisation process for high cell efficiencies and reliable modules

Russell, Richard; Tous, Loic; Philipsen, Harold; Horzel, Jörg; Cornagliotti, Emanuele; Ngamo Toko, Michel; Choulat, Patrick; Labie, Riet; Beckers, Johan; Bertens, Jurgen; Fuji, Masaki; John, Joachim; Poortmans, Jef; Mertens, Robert (2012)

Bleifrei in die Gehäusezukunft

Parton, Els; Gonzalez, Mario; Labie, Riet; Vandevelde, Bart; Vanfleteren, Jan; Ratchev, Petar (2004)

Bleifrei in die Gehäusezukunft

Parton, Els; Gonzalez, Mario; Labie, Riet; Vandevelde, Bart; Vanfleteren, Jan; Ratchev, Petar (2003-12)

Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration

Labie, Riet; Duflos, Frederic; Vandevelde, Bart; Allaert, Bart; Lauwaert, Ralph; Willems, Geert (2018)

Bond pad pitch reduction down to 40 μm: influence on solder joint fatigue for flip chip structures

Degryse, Dominiek; Labie, Riet; Vandevelde, Bart; Gonzalez, M.; Beyne, Eric (2002)

Cell-module integration concept compatible with c-Si epitaxial thin foils and with efficiencies over 18%

Dross, Frederic; Van Nieuwenhuysen, Kris; Bearda, Twan; Debucquoy, Maarten; Depauw, Valerie; Govaerts, Jonathan; Boulord, Caroline; Granata, Stefano; Labie, Riet; Loozen, Xavier; Martini, Roberto; O'Sullivan, Barry; Radhakrishnan, S.; Baert, Kris; Gordon, Ivan; Poortmans, Jef (2012)

Comparison of a Cu UBM versus a Co UBM for Sn flip chip bumps

Labie, Riet; Ratchev, Petar; Beyne, Eric (2005-06)

Cost-effective and reliable Ni/Cu plating for p- and n-type PERx silicon solar cells

Russell, Richard; Tous, Loic; Labie, Riet; Aleman, Monica; Duerinckx, Filip; Bertens, Jurgen; Horiuchi, Takeshi; Szlufcik, Jozef (2013)

Creep behavior of mixed SAC 405/ SnPb soldered assemblies in shear loading

Limaye, Paresh; Labie, Riet; Vandevelde, Bart; Vandepitte, Dirk; Verlinden, Bert (2007)

Crystalline thin-foil silicon solar cells: where crystalline quality meets thin-film processing

Dross, Frederic; Baert, Kris; Bearda, Twan; Deckers, Jan; Depauw, Valerie; El Daif, Ounsi; Gordon, Ivan; Gougam, Adel; Govaerts, Jonathan; Granata, Stefano; Labie, Riet; Loozen, Xavier; Martini, Roberto; Masolin, Alex; O'Sullivan, Barry; Qiu, Yu; Vaes, Jan; Van Gestel, Dries; Van Hoeymissen, Jan; Vanleenhove, Anja; Van Nieuwenhuysen, Kris; Venkatachalam, Srisaran; Meuris, Marc; Poortmans, Jef (2012)

Cu plated I-perl cells: ageing and humidity reliability tests

Labie, Riet; Hernandez, Jose Luis; Govaerts, Jonathan; Allebe, Christophe; Tous, Loic; Uruena De Castro, Angel; Russell, Richard; Gordon, Ivan; Baert, Kris (2011)

Cu pumping in TSVs: Effect of pre-CMP thermal budget

De Wolf, Ingrid; Croes, Kristof; Varela Pedreira, Olalla; Labie, Riet; Redolfi, Augusto; Van De Peer, Myriam; Vanstreels, Kris; Okoro, Chukwudi; Vandevelde, Bart; Beyne, Eric (2011)

Cu-Cu bonding alternative to solder based micro-bumping

Ruythooren, Wouter; Beltran Amenabar, Amaia; Labie, Riet (2007)

Cu/Sn microbumps interconnect for 3D TSV chip stacking

Agarwal, Rahul; Zhang, Wenqi; Limaye, Paresh; Labie, Riet; Dimcic, Biljana; Phommahaxay, Alain; Soussan, Philippe (2010)

Design issues and cosiderations for low-cost 3D TSV IC technology

Van der Plas, Geert; Limaye, Paresh; Mercha, Abdelkarim; Oprins, Herman; Torregiani, Cristina; Thijs, Steven; Linten, Dimitri; Stucchi, Michele; Guruprasad, Katti; Velenis, Dimitrios; Shinichi, Domae; Cherman, Vladimir; Vandevelde, Bart; Simons, Veerle; De Wolf, Ingrid; Labie, Riet; Perry, Dan; Bronckers, Stephane; Minas, Nikolaos; Cupak, Miroslav; Ruythooren, Wouter; Van Olmen, Jan; Phommahaxay, Alain; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Rakowski, Michal; De Wachter, Bart; Dehan, Morin; Nelis, Marc; Agarwal, Rahul; Dehaene, Wim; Travaly, Youssef; Marchal, Pol; Beyne, Eric (2010)