Recently added

Graph Attention Based Feature Fusion For Collaborative Perception

Ahmed, Ahmed; Mercelis, Siegfried; Anwar, Ali (2024-08-01)

Context-compensated Probabilistic Pedestrian Detection

Willems, Tim; Aelterman, Jan; Van Hamme, David (2024)

A 376μW per-channel, Drift-tolerant Translocation Recording Frontend with Event Detection for Nanopore Sensor Arrays

Das, Auro; Lin, Qiuyang; Hu, Yixiong; Sijbers, Wim; Beamish, Eric; Gevers, Juliette; Van Hoof, Chris; Gielen, Georges; Van Helleputte, Nick (2024)

Understanding the Time Dependent Write and Read Performance of IGZO-channel FeFETs

Chen, Zhuo; Ronchi, Nicolo; Banerjee, Kaustuv; Izmailov, Roman; Walke, Amey; Popovici, Mihaela Ioana; Dekkers, Harold; Pavel, Alexandru; Van den Bosch, Geert; Rosmeulen, Maarten; Afanasiev, Valeri; Van Houdt, Jan (2024)

Integration of GAA Monolayer MoS2 Nanosheet FETs with Gate First Process for Future 2D CFET Scaling

Xi, Fengben; Sharma, Himanshu; Wu, Xiangyu; Schram, Tom; Conlon, Daire; Grubbs, Robert K.; Kumar, Pawan; Ngo, Tien Dat; Ghosh, Souvik; Han, Fei; van Dorp, Dennis; Verreck, Devin; Sutar, Surajit; Smets, Quentin; Lin, Dennis; Banerjee, Kaustuv; Lockhart de la Rosa, Cesar Javier; Goux, Ludovic; Kar, Gouri Sankar (2024)

A Self-Regulated Reference Generator with Picowatt-VR-Embedded Amplifier Achieving 0.0174%/V LS and-88dB PSRR

Sawigun, Chutham; Aymerich, Joan; Kahraman, Burak; Cisneros Fernandez, Jose; Yang, Xiaolin; Mora Lopez, Carolina (2024)

Learned Parameter Compression for Efficient and Privacy-Preserving Federated Learning

Chen, Yiming; Abrahamyan, Lusine; Sahli, Hichem; Deligiannis, Nikolaos (2024)

High Density 360 /μm Aligned CNT FET with ION>1 mA/μm at -0.5 V VD and 30nm Lch

Wu, Xiangyu; Timmermans, Marina; Liu, Lijun; Xi, Fengben; Sharma, Himanshu; Lin, Zaoyang; Cott, Daire; Mana, Luca; Nuytten, Thomas; de Marneffe, Jean-Francois; Han, Han; Brems, Steven; Goux, Ludovic; Lockhart de la Rosa, Cesar Javier; Lin, Dennis; Kar, Gouri Sankar (2024)

N2 Nanosheet Pathfinding-PDK (P-PDKTM) Including Back-Side PDN

Farokhnejad, Anita; Sahoo, Siva Satyendra; Abdi, Dawit; Cousins, Jack; Dutta, Arka; Mirabelli, Gioele; Sankatali, Venkateswarlu; Verschueren, Lynn; Yang, Sheng; Zografos, Odysseas; Myers, James; Weckx, Pieter; Garcia Bardon, Marie; Hellings, Geert; Ryckaert, Julien (2024)

Understanding Anti-ferroelectric Behavior and Wake-up in La Doped HZO Metal-Ferroelectric-Metal Capacitors Using Nucleation Limited Switching Model

Walke, Amey; Clima, Sergiu; Popovici, Mihaela Ioana; Van Houdt, Jan (2024)

Experimentally Validated Thermal Modeling Prediction for BEOL and BSPDN Stacks

Chang, Xinyue; Oprins, Herman; Vermeersch, Bjorn; Cherman, Vladimir; Lofrano, Melina; Park, Seongho; Tokei, Zsolt; De Wolf, Ingrid (2024)

Thermal Insights into 3D Packaging of a HighPerformance Server SoC in Advanced Nanosheet Technology

Kumar, Nitish; Chen, Yukai; Sankatali, Venkateswarlu; Mishra, Subrat; Gupta, Ankur; Singh, Pushpapraj; Catthoor, Francky; Myers, James; Ryckaert, Julien; Biswas, Dwaipayan (2024)

Simulation of Bulge-Out Mechanism Enabling Sub-0.5 μm Scaling of Hybrid Wafer-to-Wafer Bonding

De Messemaeker, Joke; Van Sever, Koen; Tsau, Yan Wen; Zhang, Boyao; Croes, Kristof; Beyne, Eric (2024)

RF modelling and characterization of TSVs and inductive links of hybrid bonded devices

Sun, Xiao; Su, Chin-Ya; Chen, Shih-Hung; Chew, Soon Aik; Zhang, Boyao; Beyne, Eric (2024)

Methodologies for Characterization of W2W Bonding Strength

Gonzalez, Mario; Vanstreels, Kris; Okudur, Oguzhan Orkut; Iacovo, Serena; Beyne, Eric (2024)

Reliability Investigations of Advanced Photosensitive Polymer based RDL Processes Protected by Inorganic Capping Layers

Chery, Emmanuel; Bhatia, Ritwik; Sundaram, Ganesh; Pinho, Nelson; Beyne, Eric (2024)

IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism

Chancerel, Francois; Urban, Peter; Slabbekoorn, John; Halas, Simon; Bravin, Julian; Brems, Steven; Uhrmann, Thomas; Wimplinger, Markus; Phommahaxay, Alain; Beyne, Eric (2024)

Impact of Pitch Scaling on 3D Die-to-Die Interconnects

Pantano, Nicolas; Stucchi, Michele; Van der Plas, Geert; Beyne, Eric (2024)

A 32 Gb/s Full duplex Bi-directional Transceiver with Crosstalk Cancellation for Chiplet Interconnections

Park, Jae-Woo; Pantano, Nicolas; Van Der Plas, Geert; Beyne, Eric; Chun, Jung-Hoon (2024)

20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering

Ji, Xinrui; Du, Leiming; van Zeijl, Henk; Zhang, Guoqi; Derakhshandeh, Jaber; Beyne, Eric (2024)

imec Publications: Recent submissions

Graph Attention Based Feature Fusion For Collaborative Perception ﻿

Context-compensated Probabilistic Pedestrian Detection ﻿

A 376μW per-channel, Drift-tolerant Translocation Recording Frontend with Event Detection for Nanopore Sensor Arrays ﻿

Understanding the Time Dependent Write and Read Performance of IGZO-channel FeFETs ﻿

Integration of GAA Monolayer MoS2 Nanosheet FETs with Gate First Process for Future 2D CFET Scaling ﻿

A Self-Regulated Reference Generator with Picowatt-VR-Embedded Amplifier Achieving 0.0174%/V LS and-88dB PSRR ﻿

Learned Parameter Compression for Efficient and Privacy-Preserving Federated Learning ﻿

High Density 360 /μm Aligned CNT FET with ION>1 mA/μm at -0.5 V VD and 30nm Lch ﻿

N2 Nanosheet Pathfinding-PDK (P-PDKTM) Including Back-Side PDN ﻿

Understanding Anti-ferroelectric Behavior and Wake-up in La Doped HZO Metal-Ferroelectric-Metal Capacitors Using Nucleation Limited Switching Model ﻿

Experimentally Validated Thermal Modeling Prediction for BEOL and BSPDN Stacks ﻿

Thermal Insights into 3D Packaging of a HighPerformance Server SoC in Advanced Nanosheet Technology ﻿

Simulation of Bulge-Out Mechanism Enabling Sub-0.5 μm Scaling of Hybrid Wafer-to-Wafer Bonding ﻿

RF modelling and characterization of TSVs and inductive links of hybrid bonded devices ﻿

Methodologies for Characterization of W2W Bonding Strength ﻿

Reliability Investigations of Advanced Photosensitive Polymer based RDL Processes Protected by Inorganic Capping Layers ﻿

IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism ﻿

Impact of Pitch Scaling on 3D Die-to-Die Interconnects ﻿

A 32 Gb/s Full duplex Bi-directional Transceiver with Crosstalk Cancellation for Chiplet Interconnections ﻿

20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering ﻿