Recently added

Unraveling the EUV photoresist reactions : which, how much, and how do they relate to printing performance

Pollentier, Ivan; Petersen, John; De Bisschop, Peter; De Simone, Danilo; Vandenberghe, Geert (2019)

Graphene-Metal Contact Engineering and Graphene Interconnects

Politou, Maria (2019-01)

Advances in temporary carrier technology for high density fan-out device build-up

Podpod, Arnita; Phommahaxay, Alain; Bex, Pieter; Slabbekoorn, John; Bertheau, Julien; Salahouelhadj, Abdellah; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric; Guerrero, Alice; Yess, Kim; Arnold, Kim (2019)

Novel temporary bonding and debonding solutions enabling an ultrahigh interconnect density FO-WLP structure assembly with quasi-zero die shift

Podpod, Arnita; Phommahaxay, Alain; Bex, Pieter; Kennes, Koen; Bertheau, Julien; Arumugam, Hariharan; Cochet, Tom; Rebibis, Kenneth June; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019)

Experimental TDoA localisation in real public LoRa networks

Podevijn, Nico; Plets, David; Aernouts, Michiel; Berkvens, Rafael; Martens, Luc; Weyn, Maarten; Joseph, Wout (2019)

Stretchable mould interconnect optimization: peeling automation and carrierless techniques

Plovie, Bart; Yang, Yang; Dunphy, Sheila; Dhaenens, Kristof; Van Put, Steven; Bossuyt, Frederick; Vanfleteren, Jan (2019)

Design automation of meandered interconnects for stretchable circuits

Plovie, Bart; Vanfleteren, Jan; Vervust, Thomas; Vasquez Quintero, Andres; Bossuyt, Frederick (2019)

Integrating machine learning into item response theory for addressing the cold start problem in adaptive learning systems

Pliakos, Konstantinos; Joo, Seang-Hwane; Park, Jung-Yeon; Cornillie, Frederik; Vens, Celine; Van den Noortgate, Wim (2019)

Network inference with ensembles of bi-clustering trees

Pliakos, K.; Vens, C. (2019)

Joint received signal strength, angle-of-arrival, and time-of-flight positioning

Plets, David; Deprez, Wouter; Trogh, Jens; Martens, Luc; Joseph, Wout (2019)

On the impact of LED power uncertainty on the accuracy of 2D and 3D visible light positioning

Plets, David; Bastiaens, Sander; Martens, Luc; Joseph, Wout; Stevens, Nobby (2019-10)

An analysis of the impact of LED tilt on visible light positioning accuracy

Plets, David; Bastiaens, Sander; Martens, Luc; Joseph, Wout (2019-04)

Three-dimensional visible light positioning: an experimental assessment of the importance of the LEDs' Locations

Plets, David; Bastiaens, Sander; Ijaz, Muhammad; Almadani, Yousef; Martens, Luc; Raes, Willem; Stevens, Nobby; Joseph, Wout (2019)

Efficient 3D trilateration algorithm for visible light positioning

Plets, David; Almadani, Yousef; Bastiaens, Sander; Ijaz, Muhammad; Martens, Luc; Joseph, Wout (2019-05)

A 4×40 Gb/s O-band WDM slicon photonic transmitter based on micro-ring modulators

Pitris, Stelios; Moralis-Pegios, M.; Alexoudi, T.; Ban, Yoojin; De Heyn, Peter; Van Campenhout, Joris; Pleros, N. (2019)

O-band silicon photonic transmitters for datacom and computercom interconnects

Pitris, S.; Moralis-Pegios, M.; Alexoudis, Theonitsa; Ban, Yoojin; De Heyn, Peter; Van Campenhout, Joris; Lambrecht, Joris; Ramon, Hannes; Yin, Xin; Bauwelinck, Johan; Pleros, N. (2019)

Use of the Goal Structuring Notation (GSN) as generic notation for an "EMC Assurance Case"

Pissoort, Davy; Bultinck, Theresa; Boydens, Jeroen; Catrysse, Johan (2019)

Balancing elliptic curve coprocessors from bottom to top

Pirotte, Niels; Vliegen, Jo; Batina, Lejla; Mentens, Nele (2019)

Verifying the security of enclaved execution against interrupt-based side-channel attacks

Piessens, Frank (2019)

Enabling ultra-thin die to wafer hybrid bonding for future heterogeneous integrated systems

Phommahaxay, Alain; Suhard, Samuel; Bex, Pieter; Iacovo, Serena; Slabbekoorn, John; Inoue, Fumihiro; Peng, Lan; Kennes, Koen; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric (2019)

imec Publications: Recent submissions

Unraveling the EUV photoresist reactions : which, how much, and how do they relate to printing performance ﻿

Graphene-Metal Contact Engineering and Graphene Interconnects ﻿

Advances in temporary carrier technology for high density fan-out device build-up ﻿

Novel temporary bonding and debonding solutions enabling an ultrahigh interconnect density FO-WLP structure assembly with quasi-zero die shift ﻿

Experimental TDoA localisation in real public LoRa networks ﻿

Stretchable mould interconnect optimization: peeling automation and carrierless techniques ﻿

Design automation of meandered interconnects for stretchable circuits ﻿

Integrating machine learning into item response theory for addressing the cold start problem in adaptive learning systems ﻿

Network inference with ensembles of bi-clustering trees ﻿

Joint received signal strength, angle-of-arrival, and time-of-flight positioning ﻿

On the impact of LED power uncertainty on the accuracy of 2D and 3D visible light positioning ﻿

An analysis of the impact of LED tilt on visible light positioning accuracy ﻿

Three-dimensional visible light positioning: an experimental assessment of the importance of the LEDs' Locations ﻿

Efficient 3D trilateration algorithm for visible light positioning ﻿

A 4×40 Gb/s O-band WDM slicon photonic transmitter based on micro-ring modulators ﻿

O-band silicon photonic transmitters for datacom and computercom interconnects ﻿

Use of the Goal Structuring Notation (GSN) as generic notation for an "EMC Assurance Case" ﻿

Balancing elliptic curve coprocessors from bottom to top ﻿

Verifying the security of enclaved execution against interrupt-based side-channel attacks ﻿

Enabling ultra-thin die to wafer hybrid bonding for future heterogeneous integrated systems ﻿