Authors

Okoro, Chukwudi; Eneman, Geert; Gonzalez, Mario; Vandevelde, Bart; Swinnen, Bart; Stoukatch, Serguei; Beyne, Eric; Vandepitte, Dirk

Conference

Proceedings 57th Electronic Components and Technology Conference - ECTC

Title

Analysis of the induced stresses in silicon during thermocompression Cu-Cu bonding of Cu-through-vias in 3D-SIC architecture

Publication type

Proceedings paper