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Prediction of the influence of induced stresses in silicon on CMOS Performance in a Cu-through-via interconnect technology
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Prediction of the influence of induced stresses in silicon on CMOS Performance in a Cu-through-via interconnect technology
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Date
2007
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Okoro, Chukwudi
;
Gonzalez, Mario
;
Vandevelde, Bart
;
Swinnen, Bart
;
Eneman, Geert
;
Verheyen, Peter
;
Beyne, Eric
;
Vandepitte, Dirk
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1970
since deposited on 2021-10-16
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Acq. date: 2026-08-06
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Views
1970
since deposited on 2021-10-16
9
last month
4
last week
Acq. date: 2026-08-06
Citations